Seminar LMGP - 10/03/2016 - Pr.Mustafa Yavuz

Abstract

Fabrication, packaging and reliability of nano-electro-mechanical systems (NEMS) devices with low contact resistance and good mechanical bonding among multilayers are main challenges in small scale device engineering. Moreover, there are substantial barriers in integrating the nano chips into conventional MEMS and CMOS systems, or simply could be named as interconnector challenges.

As might be the potential solution, graphene and/or graphene gel, a two dimensional (2D)-honeycomb structure with sp² bonded carbon atoms, and graphene/metal hybrid structures are promising candidates as electronic connectors or patches used in NEMS because of their electron flow capacity with no significant electrical resistance and superior electronic and thermal properties. Therefore, recruiting nano-bonded hybrid-graphene interconnections can offer new opportunities for NEMS device technology and applications.